The Thermal Grizzly Minus Pad series offers high-performance thermal pads that feature a highly elastic and flexible surface with excellent thermal conductivity. These pads are designed to fill even the smallest gaps between components, ensuring optimal heat transfer. They are composed of a ceramic silicon formula complex and nano aluminum oxide, providing a constant and efficient heat transfer. The pads are easy to handle and require only a light touch to achieve optimal attachment. Technical Details: Thermal conductivity: 8.0 W/mk Temperature range: -100 C to +250 C Protects contact surfaces and prevents microcrack formation. The Thermal Grizzly Minus Pad 8 is particularly suitable for various electrical components such as PCs, notebooks, LED or LCD devices, semiconductors, transformers, and more. It is commonly used for overclocking purposes, including CPUs, memory modules, GPUs, graphics card memories, and motherboard chipsets. It is suitable for any component that utilizes a metal case as a heat sink. The Thermal Grizzly Minus Pad is a thermal pad made from modified silicone filled with metal oxides, ensuring exceptional thermal conductivity. The Minus Pad 8 is a soft gap filler that is adhesive yet easy to remove. It offers excellent thermal conductivity even with minimal contact pressure.
⚠️ WARNING (California Proposition 65): This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm. For more information, please visit www.P65Warnings.ca.gov.
